SIX SPECIALIST LABS. ONE ROOF.
ZERO OUTSOURCING.

Our Hyderabad facility houses design, assembly, test, and qualification laboratories built specifically for defence-grade electronics. Every stage is in-house — for full traceability and control.

TC

Thermal Chambers

ISO

Controlled Environment

ESD

Safe Flooring Throughout

CAL

Calibrated Equipment

RADIO TEST LAB

Our primary test and measurement lab

This is the heart of our engineering capability — equipped with calibrated instruments for hardware debug, RF measurement, and prototype validation. All benches are on ESD-safe flooring with full grounding.

Equipment's

Core test instruments

Fully calibrated test instruments for RF characterization, digital debug, and power analysis

  • Logic Analyzer
  • Signal Generator — up to 3 GHz
  • Oscilloscope — up to 200 MHz
  • Power Supplies — multi-channel DC
  • Function Generator
  • Spectrum Analyzer
Embedded systems

ESD safe assembling stations

Protected assembly

Dedicated ESD protected assembling stations for PCB population, rework, and quality inspection. All benches comply with IEC 61340-5-1.

  • Soldering stations — temperature controlled, IPC-J-STD-001
  • Microscope — for SMD inspection and rework verification
  • ESD wrist strap monitoring at every station
Licensed tools

Licensed tools

Design & simulation software

Industry standard licensed EDA and simulation tools for PCB design, FPGA development, and thermal analysis.

  • Cadence OrCAD v17+ — schematic + PCB layout
  • Xilinx System Edition v14.7+ — FPGA design & simulation
  • Mentor Graphics Hyperlynx/TxLineSi v7 — thermal simulations

In-house Excellence

End-to-end design, build, and test capabilities under one roof.

Quality Assured

Rigorous testing and validation for mission-critical reliability.

Secure & Controlled

ESD-safe environment, access control, and strict process compliance.

Faster Turnaround

Streamlined processes ensure rapid prototyping and delivery.

In-house PCB design facility

PCB design capability

  • Rigid PCBs up to 24 layers
  • Rigid-Flex Boards (up to 22 layers)
  • Signal Integrity | Power Integrity simulation
  • Thermal Analysis for power dissipation
  • Analog and Mixed-Signal PCB Design
  • High-Speed & High-Current | RF | mic | PCBs
  • IP PCB Design up to 6 GHz

PCB Design Tools

Cadence OrCAD : VER.17+

Mentor Graphics Hyperlynx | TxLineSi : VER.7

All designs reviewed to IPC standards

Every PCB design passes through DFM review and IPC-2221/IPC-7520 verification before fabrication release. IPC-A-610 Class 3 is our production quality standard



What we manufacture in-house

Hardware assembly

  • Avionics-grade enclosure machining and connectorization
  • Conformal coating and environmental sealing
  • MIL-STD-1553B and AFDX interface hardware integration
  • Multi-channel analog and video signal handling (ADC/DAC)
  • Environmental and EMI/EMC qualification support

Ruggedized embedded computing systems

  • Conduction-cooled VPX and VME single-board computers
  • High-density FPGA integration for real-time signal processing
  • MIL-STD-810G thermal and vibration qualified enclosures
  • Failsafe power management and hold-up capacitor circuits
  • High-speed PCIe Gen 4/5 backplane interconnects

Assembly & production

Surface mount technology

Semi-automated SMT assembly line for production runs. Nitrogen atmosphere reflow for solder-free joints. Full IPC-A-610 Class 3 quality gate.

  • Nitrogen atmosphere reflow oven
  • Selective soldering for mixed technology boards
  • mal coating spray boo
  • IPC-A-610 Class 3 visual inspection station
Environmental & quality testing

Environmental & quality testing

MIL-STD screening

Environmental stress screening for defence qualification. Thermal cycling, Random vibration testing and humidity explosure per MIL-STD-810H requirements.

  • Thermal cycling: -55°C to +125°C — MIL-STD-810H
  • Humidity exposure and combined environments

Products made in this facility

Embedded Launch Pad Computer (ELPC)

A vital component of a Surface-to-Air Missile (SAM) system, controlling and coordinating all pre-launch and launch operations.

8-Port-Ethernet-Switch

8-Port Ethernet Switch

A compact, high-performance networking device providing reliable data communication in embedded, industrial, aerospace and defense applications.

Landing-Gear-Controller

Landing Gear Controller (LGC)

A critical avionics subsystem responsible for controlling, monitoring and managing the safe extension and retraction of an aircraft's landing gear.

On-Board Computer

On-Board Computer (OBC)

The central processing and control unit for missile mission management, communication, guidance and system coordination — the primary missile-to-aircraft interface in the NGARM.