Technical Capabilities

PREFERRED BY DEFENCE ORGANISATIONS ACROSS INDIA

Radix Micro Technologies is one of the preferred institutions for Defence product development and manufacturing organisations across India. We deliver products and services across hardware design, PCB design, production, and embedded software development.

RF Systems & Digital Design

RF Systems

  • Broadband Amplifiers and signal distribution
  • Digital | Linear Modes | Sampling (DLVA)
  • Digital Instantaneous Frequency Measurement (DIFM)
  • Processing | Subsystems supporting up to 6 GHz
  • RF Controller & Noise generation module
  • Analog to digital convertor (ADC)
Embedded systems

Embedded systems — FPGA, electronics & DSP

  • VHDL
  • Xilinx | Altera| FPGA| SoC
  • MIL-STD-1553B Data Bus
  • UART | USB| RS232 | RS422 | ARINC-429
  • I2C | SPI | PCIe |Peripheral Interfaces
  • SAR, ADC | DAC | DDR | FLASH | EPCS
  • CAN bus, LIN, I2C protocols
  • High-Speed Data Links
  • High-Speed Video Interfaces – DVI, HDMI, SDI | 3G, SRIO
  • High Capacity NAND and NOR Flash Memories
  • GPS, VBW and VPT like Standard Comm. protocols
Mechanical enclosures

Mechanical enclosures — as per end-user requirement

Software

  • Auto CAD
  • SolidWorks
  • 3D Modeling
  • 2D Drafting



Form factors & services

  • VPX – VITA 46
  • VME – VME64x|VMEbus form factor
  • VXS – VME system extension
  • VME – Signal conditioning and glassless
  • VM – VME Hybrid configurations
  • Re-engineering and hardware upgradation services

Advanced PCB design services

PCB capabilities

  • Rigid PCBs up to 24 layers
  • Rigid-Flex Boards (up to 22 layers)
  • Signal Integrity | Power Integrity simulation
  • Thermal Analysis for power dissipation
  • Analog and Mixed-Signal PCB Design
  • High-Speed & High-Current | RF | mic | PCBs
  • IP PCB Design up to 6 GHz

PCB Design Tools

Cadence OrCAD : VER.17+

Mentor Graphics Hyperlynx | TxLineSi : VER.7

IPC standards adhered to

IPC-A-610 Class 3 IPC-2221 IPC-2252 MIL-STD-454 MIL-STD-461



What we manufacture in-house

Hardware assembly

  • Avionics-grade enclosure machining and connectorization
  • Conformal coating and environmental sealing
  • MIL-STD-1553B and AFDX interface hardware integration
  • Multi-channel analog and video signal handling (ADC/DAC)
  • Environmental and EMI/EMC qualification support

Ruggedized embedded computing systems

  • Conduction-cooled VPX and VME single-board computers
  • High-density FPGA integration for real-time signal processing
  • MIL-STD-810G thermal and vibration qualified enclosures
  • Failsafe power management and hold-up capacitor circuits
  • High-speed PCIe Gen 4/5 backplane interconnects

Radar, RF & electronic warfare modules

  • Ultra-wideband GaN Transmit/Receive (T/R) modules
  • Direct RF sampling receiver architectures
  • Low-phase noise local oscillator synthesis
  • Software-Defined Radio (SDR) front-end processing
  • Adaptive beamforming and direction-finding units

Tactical communications & encryption

  • Certified high-assurance & hardware encryptors
  • Zero-trust embedded root of trust (RoT) architecture
  • Rugged Ethernet switches with TSN capability



Embedded & application software

Signal processing — COM & DF processors

  • DPIC, QPSK decoding and encoding
  • IAT instantaneous/digital phase measurement
  • Radar video implementation

Data processing applications

  • RS-232 to MIL-STD-1553 bridge
  • MIL-1533 RTD to Ethernet bridge
  • Avionics to Ethernet bridge

Embedded Linux & front-end GUI

  • Real-time OS porting and application development
  • On-board front-end GUI for embedded system diagnostics

Related products

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